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  4. Soft error resilient and energy efficient dual modular TSPC flip-flop
 
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Soft error resilient and energy efficient dual modular TSPC flip-flop

Source
Proceedings 32nd International Conference on VLSI Design Vlsid 2019 Held Concurrently with 18th International Conference on Embedded Systems Es 2019
Date Issued
2019-05-09
Author(s)
Gupta, Shubhanshu
Mekie, Joycee  
DOI
10.1109/VLSID.2019.00077
Abstract
In this paper we propose a novel energy efficient radiation hardened dual modular true single-phase clock flip-flop (DM-TSPC FF). We show that the existing radiation hardened TSPC flip-flop designs, viz. TSPC-DICE and TSPC-Quatro, have SEU tolerant latching circuits but can get upset when radiation strikes occur in the sampling circuits. Our proposed DM-TSPC FF elegantly circumvents this problem without increasing area. We have implemented all the designs in UMC 28nm technology node. We report that our proposed DM-TSPC FF has 76.16% less power-delay product (PDP) as compared to TSPC-DICE and 80.76% less PDP as compared to TSPC-Quatro. DM-TSPC FF consumes extremely low energy. It consumes 0.71 fJ compared to TSPC-DICE which consumes 6.62 fJ and TSPC-Quatro which consumes 8.43 fJ. Apart from this, we have compared the DM-TSPC flip-flop designs with other TSPC flip-flops by implementing ISCAS’89 benchmark circuits using these flip-flops. Even for large sequential designs, we find that DM-TSPC based designs consume only about 50% of the power compared to TSPC-DICE based designs and only about 20% power compared to TSPC-Quatro based designs.
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URI
https://d8.irins.org/handle/IITG2025/23281
Subjects
Dynamic flip-flop | Index Terms: Soft error | Radiation tolerance | Single event transient (SET) | Single event upset (SEU) | True single phase clock (TSPC)
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